Shenzhen SMTfly Electronic Equipment Manufactory Ltd
Shenzhen SMTfly Electronic Equipment Manufactory Ltd
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300*300mm PCB UV Laser Depaneling Machine,Laser Singulation PCB Depanelers Features:
More quick and easy, shorten the delivery time;
High quality ,no distortion,surface clean& uniformity;
Gathering the CNC tech,laser tech,software tech…High accuracy,High speed;
PCB Laser Cutting Application
FPC and some relative materials;
FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.
Advantages of Laser PCB Depaneling/Singulation
No mechanical stress on substrates or circuits;
No tooling cost or consumables;
Versatility – ability to change applications by simply changing settings;
Fiducial Recognition – more precise and clean cut;
Optical Recognition before PCB depaneling/singulation process begins;
Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc);
Extraordinary cut quality holding tolerances as small as < 50 microns;
No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards.
PCB UV Laser Depaneling Machine,Laser Singulation PCB Depanelers Parameters:
| Parameter | ||
| Technical Parameter | Main body of laser | 1000*940*1520 |
| Weight | 450KG | |
| Power | AC220V | |
| Laser | Optoware 10/12/15/17W | |
| Material | ≤1.2mm | |
| Precision | ±20μm | |
| Platform | ±2μm | |
| Working Area | 300*300mm | |
| Maximum | 3KW | |
| Vibrating | CTI(US) | |
| Laser Wavelength | 355nm | |
| Diameter | 20±5μm | |
| Ambient | 20±2℃ | |
| Ambient | < 60% | |
| The Machine | Marble | |
PCB Depaneling Equipment Laser Depaneling of Flex PCB-FPC Cutting Machine Description:
PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.
Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.
More information welcome to contact us:
Email/Skype: s5@smtfly.com
Mobile/Wechat/WhatsApp: +86-136-8490-4990