Industrial PCB Laser Depaneling with Different Laser Source 10/12/15/17W

Challenges of Depaneling using Routing/Die Cutting/Dicing Saws

• Damages and fractures to substrates and circuits due to mechanical stress
• Damages to PCB due to accumulated debris
• Constant need for new bits, custom dies, and blades
• Lack of versatility – each new application requires ordering of custom tools, blades, and dies
• Not good for high precision, multi-dimensional or complicated cuts
• Not useful PCB depaneling/singulation smaller boards

Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.

Advantages of Laser PCB depaneling/singulation

• No mechanical stress on substrates or circuits
• No tooling cost or consumables.
• Versatility – ability to change applications by simply changing settings
• Fiducial Recognition – more precise and clean cut
• Optical Recognition before PCB depaneling/singulation process begins. CMS Laser is one of the few companies to provide this feature.
• Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)
• Extraordinary cut quality holding tolerances as small as < 50 microns.
• No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards

Specification