No mechanical stress on substrates or circuits
No tooling cost or consumables.
Versatility – ability to change applications by simply changing settings
Fiducial Recognition – more precise and clean cut
Optical Recognition before PCB depaneling/singulation process begins.
Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)
Extraordinary cut quality holding tolerances as small as < 50 microns.
No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards

Description:

Neat and smooth edge, no burr or overflow

Wide application range, including FPC exterior cutting, profile cutting, drilling, opening window for covering, etc.

Laser wavelength: 355nm

Rated power: 10W/12W/15W/18W@30KHz

Galvanometer working field Per One Process: 40 × 40mm

Power consumption for the hole machine: 2KW

Specification:

Laser	Q-Switched diode-pumped all solid-state UV laser
Laser Wavelength	355nm
Laser Power	10W/12W/15W/17W@30KHz
Positioning Precision of Worktable of Linear Motor	±2μm
Repetition Precision of Worktable of Linear Motor	±1μm
Effective Working Field	460mmX460mm(Customizable)
Laser Scanning Speed	2500mm/s (max)
Galvanometer Working Field Per One Process	40mmх40mm

Laser PCB Depanelizer Machine for Neat and Smooth Edge Cutting

PCB Separator For Motorized